- SD54G0 EdgeCONTROL™ (SD54G0)Low modulus retention dam specifically formulated to offer low cure stress & low warpage for liquid encapsulation of BGA & MCM packages. Good adhesion to various rigid and flexible organic ...
- SF5021 OptiCLEAR™ Liquid Encapsulant Fill (SF5021)Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor ...
- WL2000 Wafer Level Coating (WL2000)Epoxy based protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or ...
Collection: Electronic Chemicals
Showing 3 Products
Showing 3 results