- EW8002 NoSWEEP™ Wire Bond Encapsulant (EW8002)100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch ...
- HV331 Silicone Gel Kit (HV331)2 component, low viscosity silicone encapsulant suitable for encapsulation applications including sesnsitive optoelectronic assemblies. Stress free & thermally curable. Application(s): ...
- SF5021 OptiCLEAR™ Liquid Encapsulant Fill (SF5021)Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor ...
- SF801 A&B OptiCLEAR™ Liquid Encapsulant Fill (SF801A&B)2 component epoxy designed for bonding, encapsulating, & sealing applications require good optical clarity. Curable at ambient temperatures or preferably with moderate heat, excellent adhesion ...
Collection: Electronic Chemicals
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