- EW8002 NoSWEEP™ Wire Bond Encapsulant (EW8002)100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch ...
- SD1011 EdgeCONTROL™ (SD1011)Ships on dry ice (+$45.00 to S&H).100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well ...
- SD54G0 EdgeCONTROL™ (SD54G0)Low modulus retention dam specifically formulated to offer low cure stress & low warpage for liquid encapsulation of BGA & MCM packages. Good adhesion to various rigid and flexible organic ...
- SF5021 OptiCLEAR™ Liquid Encapsulant Fill (SF5021)Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor ...
- SF801 A&B OptiCLEAR™ Liquid Encapsulant Fill (SF801A&B)2 component epoxy designed for bonding, encapsulating, & sealing applications require good optical clarity. Curable at ambient temperatures or preferably with moderate heat, excellent adhesion ...
- SF850 A&B OptiCLEAR™ Liquid Encapsulant Fill (SF850K)2 component epoxy designed for encapsulating & coating applications requiring good clarity & high heat resistance. Excellent adhesion to many substrates including metals, glass, & ...
- UC5001 EasyFILL™ (UC5001)Rapid curing capillary flow underfill with low stress cure, high durability, high Tg, & low CTE. Thermally curable.
- WL2000 Wafer Level Coating (WL2000)Epoxy based protective &/or negative photoresist coating suited for applications at the wafer level. Excellent adhesion, good chemical resistance, low viscosity, high gloss, & UV &/or ...
Collection: Electronic Chemicals
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