- EW8002 NoSWEEP™ Wire Bond Encapsulant (EW8002)100% solid, silica filled liquid encapsulant designed for quick self-leveling in large dam & fill or glob top applications, & encapsulation of narrow diameter, long, & ultra fine pitch ...
- HV331 Silicone Gel Kit (HV331)2 component, low viscosity silicone encapsulant suitable for encapsulation applications including sesnsitive optoelectronic assemblies. Stress free & thermally curable. Application(s): ...
- PC8007 Low Viscosity Glob Top Encapsulant (PC8007)Ships on dry ice (+$45.00 to S&H). PC8007 is a high performance epoxy for encapsulation applications. The product is suited for bonding and sealing uses requiring high modulus and temperature ...
- SD1011 EdgeCONTROL™ (SD1011)Ships on dry ice (+$45.00 to S&H).100% solids liquid encapsulant designed for encapsulation & bonding applications requiring very high modulus & heat resistance. Thixotropic & well ...
- SD54G0 EdgeCONTROL™ (SD54G0)Low modulus retention dam specifically formulated to offer low cure stress & low warpage for liquid encapsulation of BGA & MCM packages. Good adhesion to various rigid and flexible organic ...
- SF5021 OptiCLEAR™ Liquid Encapsulant Fill (SF5021)Low modulus fill material specifically designed to offer efficient light transmission & low cure stress. A 100% solids, unfilled, liquid encapsulant designed for encasulation of semiconductor ...
- SF801 A&B OptiCLEAR™ Liquid Encapsulant Fill (SF801A&B)2 component epoxy designed for bonding, encapsulating, & sealing applications require good optical clarity. Curable at ambient temperatures or preferably with moderate heat, excellent adhesion ...
- SF850 A&B OptiCLEAR™ Liquid Encapsulant Fill (SF850K)2 component epoxy designed for encapsulating & coating applications requiring good clarity & high heat resistance. Excellent adhesion to many substrates including metals, glass, & ...
Collection: Electronic Chemicals
Showing 9 Products
Showing 9 results